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Morse Micro Introduces MM8108: the Smallest, Fastest, Lowest Power and...

Latest Wi-Fi HaLow System-on-Chip (SoC) Sets a New Benchmark for Performance, Efficiency, Security and Versatility in IoT Accompanying USB Dongle Enables Rapid and Robust Wi-Fi HaLow Integration in...

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Ceva Powers Oritek’s Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles

LAS VEGAS, NV. – CES 2025 – January 8, 2025  – Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably...

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NXP’s New Ultra-low-power MCX L Microcontrollers Enable the Next Generation...

What’s new: As part of its ongoing initiative to provide innovative systems solutions for industrial and home energy management, NXP Semiconductors today announced the MCX L14x and MCX L25x, the first...

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TDK launches next-gen TWS solution VibeSense360™ enabling premium immersive...

The next-gen VibeSense360 TWS solution includes motion sensor hardware and software Running on the latest SmartMotion® ICM-45606 IMU, the next-gen VibeSense360 enables concurrent features of spatial...

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TriLite to Showcase Smart Glasses and Automotive Projection Innovations at...

Vienna, Austria – January 13, 2025 – TriLite, a pioneer in ultra-compact projection display technology, announces its participation at this year’s SPIE AR | VR | MR event in San Francisco, California....

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Renesas Introduces New MOSFETs with Exceptional Performance

TOKYO, Japan, January 9, 2025 ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today introduced new 100V high-power N-Channel MOSFETs that deliver...

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Zonal Architecture: Making the Car of the Future Possible — Molex and Mouser...

  In order to keep pace with the ever-increasing design concerns for the future of automotive designs, we need to consolidate ECUs, reduce harness size and complexity, and reduce our overall design...

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Same Sky Expands Pogo Pins Product Line

LAKE OSWEGO, Ore. — January 14, 2025 — Same Sky’s Interconnect Group today announced the expansion of its pogo pins product line with the introduction of 40 new models. The CPG family of pogo pins...

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Avnet Insights Survey: Is There Endless Opportunity for AI in Product Design?

PHOENIX – January 14, 2025 – Engineers are looking at the opportunity for Artificial Intelligence (AI) in product development with cautious optimism as many are still assessing in which areas of their...

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KYOCERA AVX Releases First Two-Piece STRIPT® Crimp Contacts

FOUNTAIN INN, S.C. (January 14, 2025) – KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future,...

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